FOR FURTHER INFORMATION AND TO APPLY ONLINE, SEE:
epoc.org/scholarship
PLEASE SPREAD THE WORD ABOUT THIS OPPORTUNITY!
The Environmental Professionals Organization of Connecticut (EPOC) recognizes its duty to assist in the education of individuals planning a career in the environmental industry. Consequently, the EPOC Environmental Scholarship Fund was established in 1998. The purpose of the Scholarship Fund is to assist Connecticut residents, or an immediate family member (spouse or child) of an EPOC Member in good standing, who are enrolled in accepted programs of study (see below) preparing the student to become a Technical Environmental Professional* in the State of Connecticut as defined by the CT DEEP, or a professional in a related service discipline who may render technical assistance to the Technical Environmental Professional.
*As defined by the CT DEEP, a Technical Environmental Professional (TEP) is anyone, including a Licensed Environmental Professional, who collects soil, water vapor, or air samples in order to investigate and remediate pollution to the state's soil or water, and who may be directly employed or retained as a consultant by a public or private employer.
Accepted programs of study include the following: Environmental Science, Geology, Biology, Chemistry, Hydrogeology, Hydrology, Earth Science, Natural Resource Management, Ecology, Soil Sciences, Water Resources, Toxicology, Wetland Science, Engineering (Civil, Environmental, Chemical), and Other Related Degreed Environmental Programs if deemed relevant to the stated goal of the scholarship.
We ask that you assist us in publicizing the availability of the scholarships. If you know of students who meet our criteria, or professors, department chairs or personnel in financial aid offices at the universities you have attended, please inform them of the availability of the scholarship fund and direct them to EPOC's website.
For further information about the EPOC Scholarship Fund, contact Seth Molofsky at (860) 537-0337 or Email: epoc@epoc.org.
